The latest trend in electronic device industry points towards the compact and fast devices and to attain the same requirement, scientist from US are working on a novel technology-Nano technology.
The future processors are suppose to be more powerful and use less energy and a team at California University is working on a silicon wafers between five and 20 nanometres thick, which may be used in the designing of IC(Integrated Circuit) chips. The novel technology is based upon BCP(block co-polymer lithography).
According to the reports, microprocessor companies like Intel and IBM have invested billions of dollars in developing the new technology.
The future processors are suppose to be more powerful and use less energy and a team at California University is working on a silicon wafers between five and 20 nanometres thick, which may be used in the designing of IC(Integrated Circuit) chips. The novel technology is based upon BCP(block co-polymer lithography).
According to the reports, microprocessor companies like Intel and IBM have invested billions of dollars in developing the new technology.
No comments:
Post a Comment